🔂 Layouts

Making layouts

🕹 Component placement

Ensure Bill of Materials with vendor links and datasheets are ready
Refer to the correct datasheet version number
Check manufacturer capabilities on via size and track width
Define Net Classes
Select mostly SMD components with size 0805
Draw the edge cuts layer to contain all components with grid size 1.000mm
Round all sharp edges on the edge cuts layer with grid size 25 mils
Place components into functional building blocks where possible
Place connectors, LEDs, switches, buttons and antennas for mechanical considerations with grid 25 mils
Adjust components for less congested routing and space signal traces far apart
Add multiple LED indictors to show power on each rail and some digital functioning
Add isolation jumpers to isolate power from some circuits for debugging

Lay down power and ground planes first
Connect all the power and ground tracks to the planes
Layout critical tracks and route them first E.g. differential pairs
Place decoupling capacitors physically and electrically close to the desired components
Snake tracks around the board
Use standard grid size 10 mils for routing traces
Route components, signals and power paths on layer 1 and ground return on layer 2

Run b to refill all zones on all layers in KiCad
Ensure ERC and DRC are passing
Look through the 3D view
Print individual layers and check them
Export layers F.Cu, B.Cu, F.SilkS B.SilkS, F.Mask, B.Mas, Edge.Cuts in Gerber format
Export drill files NPTH.drl, PTH.drl
Check Gerber format layer by layer
Check Solder mask openings smaller than the solder pad
Check no text on solder pads